• SMT Manufacturing lines

Prototype

High Speed - L Shape layout for time/space compression

• Fully automated screen printing with vision and paste deposition measurement

• High speed SMT placement

• Fine pitch to 15 mil
• BGA, uBGA
• CSP
• 0201 discrete

• Mixed technology
• Hi-density population including high speed digital, analog, rf
• Reflow - RoHS/Hi-Temp solder Capable
• Workmanship Standards IPC-610 Class II, III

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